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Verilog FPGA芯片设计

《Verilog FPGA芯片设计》本书除讲述基本的设计技巧外，还深入介绍了多模块整合设计技术，适合各层次设计者参考使用。希望这本书能带领读者进入以Verilog语言为主的各种相关设计领域中，让读者熟悉Verilog语言的全貌。

Verilog FPGA芯片设计造价信息

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外接API芯片

规格型号：
unilumin 5.1
价格行情：
材料单位：
颗
材料品牌：
材料税率：
13%
供应商：
深圳市洲明科技股份有限公司
报价时间：
2025-05-15

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芯片卡

规格型号：
CA-MS-C品种:系统调试卡;型号:Mifare-1;
价格行情：
材料单位：
个
材料品牌：
霍尼韦尔
材料税率：
13%
供应商：
石家庄冠旭商贸有限公司
报价时间：
2025-05-15

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芯片卡

规格型号：
CA-EI-C品种:ID卡片;
价格行情：
材料单位：
个
材料品牌：
霍尼韦尔
材料税率：
13%
供应商：
石家庄冠旭商贸有限公司
报价时间：
2025-05-15

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滴胶卡IC复旦芯片

规格型号：
说明:100张起售
价格行情：
材料单位：
瓶
材料品牌：
宏卡
材料税率：
13%
供应商：
沈阳宏卡科技开发有限公司
报价时间：
2025-05-15

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滴胶卡ID芯片

规格型号：
说明:100张起售
价格行情：
材料单位：
瓶
材料品牌：
宏卡
材料税率：
13%
供应商：
沈阳宏卡科技开发有限公司
报价时间：
2025-05-15

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自动洗片机

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价格行情：
材料单位：
台班
材料税率：
地区时间：
韶关市2010年8月信息价
所属行业：
建筑工程
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X光片脱水烘干机

规格型号：
ZTH-340
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材料单位：
台班
材料税率：
地区时间：
韶关市2010年8月信息价
所属行业：
建筑工程
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弯管机(带胎芯压机)

规格型号：
WC27-108
价格行情：
材料单位：
台班
材料税率：
地区时间：
汕头市2011年3季度信息价
所属行业：
建筑工程
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弯管机(带胎芯压机)

规格型号：
WC27-108
价格行情：
材料单位：
台班
材料税率：
地区时间：
汕头市2011年2季度信息价
所属行业：
建筑工程
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弯管机(带胎芯压机)

规格型号：
WC27-108
价格行情：
材料单位：
台班
材料税率：
地区时间：
广州市2011年1季度信息价
所属行业：
建筑工程
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系统芯片

规格型号：
:(Vcc/Vdd)1.81V - 2V数据转换器A/D: 16x12b振荡器类型:内部工作温度:-40°C - 125°C(TA)
需求量：
20
报价数：
1
材料品牌：
材料档次：
中档
费用说明：
含税费 | 含运费
询价时间：
2022-08-09

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RFID芯片

规格型号：
工作频率:915±45MHz
需求量：
10600
报价数：
1
材料品牌：
材料档次：
中档
费用说明：
不含税费 | 含运费
询价时间：
2018-08-21

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信息芯片

规格型号：
DS1990A-F5
需求量：
5926
报价数：
1
材料品牌：
DALLAS
材料档次：
普通
费用说明：
含税费 | 含运费
询价时间：
2015-07-15

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DSP芯片卡

规格型号：
1、DSP资源扩展卡2、含2个DSP芯片3、处理芯片运算能力不劣于800MHz
需求量：
1
报价数：
1
材料品牌：
材料档次：
中档
费用说明：
不含税费 | 不含运费
询价时间：
2020-05-11

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MI高频芯片房卡

规格型号：
1.名称:MI高频芯片房卡2.参数:M1高频芯片卡,房卡智能化使用第十扇区
需求量：
1000
报价数：
1
材料品牌：
肯天智能；深圳
材料档次：
中高档
费用说明：
含税费 | 含运费
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Verilog FPGA芯片设计常见问题

FPGA 芯片价格是多少

从高到低都有，低的几百，贵的应该上万吧，不太确定。还有些特殊工艺的，更贵。用过一个中等偏下的，4500+。
什么是无生产线芯片设计公司

没有具体的定义，可以看一下下面的一则文章： ARM中国业务总裁：如何成为成功的(无生产线)芯片设计公司谭军，英国ARM公司中国业务总裁兼安谋咨询（上海）有限公司总经理 10 多年来，半导体产业的细分...
24v5A开关电源用什么芯片设计

可以用经典的384X系列IC设计，反激拓扑

基于FPGA的音频编解码芯片控制器设计

基于FPGA的音频编解码芯片控制器设计

基于FPGA的音频编解码芯片控制器设计

格式：pdf

大小：1.1MB

页数： 65页

摘要现如今随着可编程逻辑器件及相关技术的不断发展和完善，其技术在现代电子技术领域表现出的明显技术领先性，具有传统方法无可比拟的优越性。近几年，嵌入式数字音频产品受到越来越多消费者的青睐。在 MP3、手机等电子产品中，音频处理功能已成为不可或缺的重要组成部分，而高质量的音效是当前发展的重要趋势。数字语音集成电路与嵌入式微处理器相结合，既实现了系统的小型化、低功耗，又降低了产品开发成本，提高了设计的灵活性，具有体积小、扩展方便等诸多特点，具有广泛的发展前景。本设计基于 SOPC技术，利用 Verilog HDL 硬件描述语言开发的基于 FPGA 的音频编解码芯片控制器，以实现对音频编解码芯片 WM8731 的控制。并根据 Verilog HDL 可移植性和不依赖器件的特点。经过适当的修改，该控制器可以移植到各类 FPGA 中，以控制兼容 I2C和 I2S总线

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芯片设计和制造对铜丝键合工艺的影响分析

芯片设计和制造对铜丝键合工艺的影响分析

芯片设计和制造对铜丝键合工艺的影响分析

格式：pdf

大小：22KB

页数： 3页

芯片设计和制造对铜丝键合工艺的影响分析【摘要】以实际案例为基础分析，从三极管芯片设计和制造上解决铜丝键合工艺容易造成芯片弹坑损伤的问题。【关键词】铜丝键合弹坑芯片结构 1 概要在半导体铜丝键合工艺中讨论最多的都是在封装键合领域内讨论如何改进设备，材料和工艺方法去匹配铜丝工艺，提升铜丝工艺的可靠性和实用性，但很少有讨论在芯片设计和制造方面能做多少改进。本文重点分析芯片设计制造对铜丝工艺的的影响。从铜丝键合工艺主要的失效分析统计来看，铜丝工艺在铝层弹坑损伤上要比金丝工艺严重得多。弹坑损伤在封装工艺上总存在工艺宽容度窄，控制难度高的问题，容易影响三极管的良品率和可靠性。所以改进的目标就定在如何能把芯片键合区设计成能经受住铜丝键合高强度冲击而又不容易发生弹坑损伤或是能够缓冲铜丝键合冲击应力的键合区结构上。 2 键合区铝层的分析键合区铝层是的主要作

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FPGA芯片架构设计与实现目录信息

第1 章 FPGA 架构总体设计 ········································································· 1 1.1 FPGA 芯片研制流程·········································································· 1 1.2 FPGA 架构设计流程·········································································· 7 1.3 FPGA 规模和资源划分 ····································································· 17 1.4 FPGA 中功能模块划分 ····································································· 20 本章参考文献 ······················································································ 26 第2 章 FPGA 中时钟网络 ·········································································· 30 2.1 简介 ···························································································· 30 2.2 FPGA CDN 建模 ············································································· 33 2.3 时钟网络设计方法 ·········································································· 43 2.4 时钟网络的灵活性 ·········································································· 48 2.5 路由级联 ······················································································ 51 2.6 仿真实验 ······················································································ 55 2.7 时钟网络热学建模 ·········································································· 61 2.8 仿真实验 ······················································································ 62 本章参考文献 ······················································································ 66 第3 章 FPGA 中电源/地线网络和漏电流 ······················································· 68 3.1 电源/地线网络 ··············································································· 68 3.2 IR-DROP 分析与优化 ········································································ 71 3.3 漏电流组成 ··················································································· 73 3.4 降低漏电流的方法 ·········································································· 74 3.5 基于VIA 分布的IR-DROP 分析 ··························································· 77 3.6 仿真实验 ······················································································ 81 3.7 不均匀测试点的IR-DROP 求解 ··························································· 87 3.8 FPGA 电源网络IR-DROP 分析 ···························································· 89 本章参考文献 ······················································································ 94 第4 章 FPGA 中可编程逻辑单元 ································································· 98 4.1 基于多路选择器的逻辑单元 ······························································ 98 4.2 基于四输入LUT 的可编程逻辑单元的设计 ·········································· 102 4.3 LUT 的模型与实现 ········································································ 103 4.4 LUT 的输入数目K 的确定 ······························································· 106 4.5 进位逻辑 ····················································································· 109 4.6 基于查找表结构的FPGA 的不足 ······················································· 115 4.7 AIC 结构逻辑簇 ············································································ 117 4.8 基于AIC 结构FPGA 的逻辑簇 ························································· 120 4.9 面向AIC 的映射工具及结构评估平台 ················································ 124 4.10 结构特征匹配的AIC 簇互连优化 ···················································· 125 4.11 仿真分析和比较 ·········································································· 131 本章参考文献 ····················································································· 133 第5 章 FPGA 中可编程I/O 模块 ································································· 136 5.1 可编程I/O 系统结构 ······································································ 136 5.2 IOE 中的可编程输入缓冲器设计 ······················································· 138 5.3 IOE 中的可编程输出缓冲器设计 ······················································· 144 5.4 可编程I/O 的后端版图设计······························································ 156 5.5 高可靠I/O 模块的后端版图与测试 ····················································· 166 5.6 可编程I/O 的供电策略 ··································································· 172 5.7 全芯片IO 的ESD 技术 ··································································· 173 本章参考文献 ····················································································· 179 第6 章 FPGA 中DDR 存储器接口 ······························································ 182 6.1 DDR SDRAM 芯片的工作原理 ·························································· 182 6.2 FPGA 芯片中DDR 存储器接口系统设计 ············································· 184 6.3 DDR 存储器接口控制器的设计和验证 ················································ 191 6.4 延时锁相技术 ··············································································· 194 6.5 延时锁定环电路的分析与对比 ·························································· 196 6.6 数字延时锁定环电路的性能分析与优化 ·············································· 201 6.7 延时锁定环线性模型与稳定性分析 ···················································· 205 本章参考文献 ····················································································· 209 第7 章 FPGA 中数字延时锁定环 ································································ 213 7.1 实现相移的全数字延迟锁定环 ·························································· 213 7.2 数字控制延时链 ············································································ 215 7.3 时间数字转换器 ············································································ 220 7.4 双向移位计数器 ············································································ 221 7.5 鉴相器与锁定逻辑 ········································································· 222 7.6 延迟锁定环的版图设计 ··································································· 224 7.7 延迟锁定环环路的仿真 ··································································· 224 7.8 芯片的物理实现与测试平台 ····························································· 225 7.9 DDR 接口的数据通路的测试验证 ······················································ 227 7.10 数字延时锁定环的测试 ································································· 229 7.11 数字占空比矫正电路的测试 ···························································· 232 本章参考文献 ····················································································· 234 第8 章 FPGA 中连线连接盒 ······································································ 236 8.1 引言 ··························································································· 236 8.2 问题分析 ····················································································· 237 8.3 利用模拟退火算法优化CB 拓扑结构 ·················································· 241 8.4 实验及结果分析 ············································································ 246 8.5 连线开关盒的电路结构设计方法 ······················································· 251 本章参考文献 ····················································································· 259 第9 章 FPGA 中互连线段长度分布 ····························································· 261 9.1 所提优化方法的基本思路 ································································ 261 9.2 以面积延时积最小为目标的优化 ······················································· 265 9.3 针对所提优化方法的讨论 ································································ 268 9.4 设计实验 ····················································································· 269 9.5 FPGA 芯片的设计实现 ···································································· 270 9.6 芯片的测试准备 ············································································ 272 本章参考文献 ····················································································· 275 第10 章 FPGA 中的配置模块 ···································································· 277 10.1 配置系统的基本组成及特点 ···························································· 277 10.2 配置系统的功能需求 ···································································· 279 10.3 配置系统的硬件结构分析 ······························································ 281 10.4 配置码流协议的结构及其对配置系统的影响 ······································· 286 10.5 配置系统总体框架 ······································································· 292 10.6 配置码流协议的设计 ···································································· 297 10.7 配置系统的电路设计与实现 ···························································· 300 10.8 配置系统采用的验证工具与方法 ······················································ 305 10.9 配置系统的验证方案与功能点的抽取 ················································ 310 10.10 配置系统功能验证平台的设计 ······················································· 312 10.11 配置系统验证结果 ······································································ 319 本章参考文献 ····················································································· 324

FPGA设计与应用目录

第1章FPGA概述 1.1FPGA的发展历程 1.2FPGA的基本原理 1.2.1基于查找表的FPGA的基本结构及逻辑实现原理 1.2.2基于乘积项的FPGA的基本结构及逻辑实现原理 1.2.3FPGA的配置应用 1.3FPGA的设计方法 1.4FPGA的设计流程 1.4.1基于"自顶向下"设计方法的FPGA设计流程 1.4.2基于"自顶向下"设计流程的优点 1.5总结与结论 第2章硬件描述语言入门 2.1VHDL入门 2.1.1VHDL的模块组织 2.1.2基本的数据类型及常量、变量、信号 2.1.3运算符及表达式 2.1.4VHDL基本语句 2.1.5典型电路的设计 2.2VerilogHDL入门 2.2.1VerilogHDL模块的结构 2.2.2基本的数据类型及常量、变量 2.2.3运算符及表达式 2.2.4语句 2.2.5典型电路的设计 2.2.6小结 2.3总结与结论 第3章简单电路的HDL设计 3.1基本组合逻辑运算 3.1.1与运算 3.1.2或运算 3.1.3异或运算 3.1.4与非运算 3.1.5二选一多路选择器 3.1.6两位比较器 3.2基本时序器件--寄存器 3.2.1D触发器 3.2.2T触发器 3.2.3J-K触发器 3.2.4时序器件--移位寄存器 3.3简单数学运算 3.3.14位加法器 3.3.24位计数器 3.3.34位乘法器 3.4总结与结论 第4章FPGA的同步设计 4.1同步的定义 4.2同步部件 4.2.1基本的同步部件 4.2.2同步清除D型触发器 4.2.3E型触发器 4.2.4T型触发器 4.2.5同步R-S触发器 4.2.6R型触发器 4.3状态产生 4.3.1状态的无条件执行 4.3.2状态的有条件执行 4.4中央允许产生器 4.5同步清除 4.6时钟歪斜的清除 4.7异步接口 4.7.1互相同步的系统 4.7.2互相异步的系统 4.7.3同步系统的异步输入 4.7.4握手发送数据的安全性 4.7.5微处理器存储器映射中的FPGA 4.7.6亚稳定性 4.7.7小结 4.8总结与结论 第5章常见的FPGA设计实例 …… 第6章FPGA的配置与编程 第7章3DES算法的FPGA实现及其在3DES-PCI安全卡中的应用 第8章FPGA发展趋势 附录1世界著名的FPGA厂商 附录2常用的FPGA开发工具 参考文献

数字滤波器的MATLAB与FPGA实现——Altera/Verilog版内容简介

本书以Altera公司的FPGA器件为开发平台，采用MATLAB及Verilog HDL语言开发工具，详细阐述了数字滤波器的实现原理、结构、方法及仿真测试过程，并通过大量工程实例分析其在FPGA实现过程中的具体技术细节。其主要内容包括FIR滤波器、IIR滤波器、多速率滤波器、自适应滤波器、变换域滤波器、解调系统的滤波器设计等。本书思路清晰、语言流畅、分析透彻，在简明阐述设计原理的基础上，追求对工程实践的指导性，力求使读者在较短的时间内掌握数字滤波器的FPGA设计知识和技能。

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